发明名称 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
摘要 PROBLEM TO BE SOLVED: To smoothly process a wafer in an application and development processing apparatus optionally selecting a cassette to which the wafer returns when processing is ended. SOLUTION: After a cassette C1 is placed on a cassette placing plate 31, a controller 11 instructs an application and development processing apparatus 10 to start processing a wafer in the cassette C1. Then, the controller 11 instructs the application and development processing apparatus 10 about a cassette C2 on the cassette placing plate 31 to which the wafer W is to be transferred when the processing is ended. When the number of remaining processing steps of the wafer W is at a predetermined set number and the cassette to which the wafer W is to be transferred when the processing is ended is not instructed, a warning is issued from the application and development processing apparatus 10. The controller 11 is notified of the warning from the application and development processing apparatus 10, and the controller 11 instructs a cassette to which the wafer W is to be transferred. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009094461(A) 申请公布日期 2009.04.30
申请号 JP20080153422 申请日期 2008.06.11
申请人 TOKYO ELECTRON LTD 发明人 TSUKINOKI WATARU;YAMAMOTO YUICHI
分类号 H01L21/027;B05C13/02;G03F7/30 主分类号 H01L21/027
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