| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology by which a metal can be filled into a plurality of vias in parallel by plating processing without causing unevenness. SOLUTION: A plating bath used in plating processing contains a restraining agent for restraining filling speed. A voltage at which the restraining agent is settled on the surface of a substrate is applied to the substrate before performing filling of metal. Then, a voltage at which the metal is filled into vias is applied to the substrate. While continuously filling the metal into a plurality of vias, when any of the plurality of vias is filled to a previously determined state, a voltage having a voltage value (strike voltage) higher than the voltage at which the metal is filled is applied to the substrate for a predetermined time. When the target number of vias are each filled to a desired state, application of the voltage to the substrate is finished. COPYRIGHT: (C)2009,JPO&INPIT
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