| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition which can form cured products excellent in hardness, solvent resistance, heat resistance and adhesiveness to substrates, and to provide a cured product which is excellent in hardness, solvent resistance, heat resistance and the adhesiveness to a substrate. SOLUTION: This curable resin composition is characterized by comprising a polymer A containing at least an epoxy group-containing vinylic monomer a1 as a monomer component, and a polymer B containing at least an alkoxysilyl group-containing vinylic monomer represented by general formula (I) [wherein, R<SP>1</SP>is a hydrogen atom or a 1-7C alkyl group; E is a single bond or a divalent hydrocarbon group; R<SP>2</SP>and R<SP>3</SP>are each identically or differently a 1-6C alkyl group or a 1-6C alkoxyl group; R<SP>4</SP>is a 1-6C alkyl group; (x) is 0 or 1; (y) is an integer of 1 to 10] as a monomer component. COPYRIGHT: (C)2009,JPO&INPIT |
