| 摘要 |
<p>The soldering plant for the recognition of impurities contained in a liquid solder (3) for soldering electronic components (15), comprises a soldering bath (1), which contains the liquid solder in the soldering operation, a device for the recognition of the impurities, a sensor (17, 19) for measuring the temperature of the solder during a cooling or a heating process in a temperature range, in which a phase transition of the solder take place, with which a quantitatively large part of the solder is solidified or melted, and an evaluation unit (35). The soldering plant for the recognition of impurities contained in a liquid solder (3) for soldering electronic components (15), comprises a soldering bath (1), which contains the liquid solder in the soldering operation, a device for the recognition of the impurities, a sensor (17, 19) for measuring the temperature of the solder during a cooling or a heating process in a temperature range, in which a phase transition of the solder take place, with which a quantitatively large part of the solder is solidified or melted, and an evaluation unit (35). The evaluation unit shows a time curve of the measured temperature (T(t)) and/or a derived parameter (K) with the time curve of reference curves (T r(t), T r l 1(t), T r l 2(t), T r l 3(t)), which occurs to the time curve of the temperature of two reference solder (l, l1, l2, l3) during the same cooling or heating process in the temperature range and/or the reference parameter derived from the reference curves is compared. A reference solder (l) is the pure solder, and all other reference solder (l1, l2, l3) are present with known degree of impurity, which is produced from the pure solder by an addition of a known quantity of the predetermined material. A deviation (delta ) dependent on the impurity degree of the solder is derived on the basis of the comparison and sets to a further evaluation, processing and/or displaying. The device for the recognition of the impurities comprises a device for removing a given quantity of liquid solder from the bath and a container for the reception of the removed solder. The temperature sensor is arranged in such a manner that the temperature of the solder is measured in the container and in the bath. In the soldering plant: the parameter (K) is a temperature, at which the time curve of the measured temperature (T(t)) has a plateau-shaped section; the reference parameter (K r) is the fusing temperature (T s) of the pure solder (L); and the derived deviation (delta ) is a difference between the parameter and the reference parameter. Independent claims are included for: (1) a method for the recognition of impurities contained in a solder; and (2) a method for the operation of a soldering plant.</p> |
