LED PACKAGE METHODS AND SYSTEMS

摘要

Methods and systems are provided for LED modules (5650) that include an LED die (5654) integrated in an LED package with a submoupt (5670) that includes an electronic component for controlling the light emitted by the LED die. The electronic component integrated in the submount may include drive hardware, a network interface, memory, a processor, a switch-mode power supply, a power facility, or another typ of electronic component.