| 摘要 |
Methods, systems, and apparatuses for integrated circuit packages are provided. An integrated circuit package includes a metal layer, an integrated circuit die, and an adhesive material. The metal layer has a first surface that has a die-attach region. The metal layer further has one or more recessed regions formed in the first surface of the metal layer adjacent to the die-attach region. The adhesive material attaches a first surface of the die to the die-attach region and at least partially fills the recessed region(s). Excess adhesive material flows into the recessed region(s) during application of the die to the die-attach region, so that the side surfaces of the die remain substantially uncovered by the adhesive material. By preventing the excess adhesive material from covering the side surfaces of the die, the adhesive material is prevented from penetrating the side surfaces of the die, which could damage the die.
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