| 摘要 |
An apparatus and a method for bonding a substrate are provided to prevent an electric charge of a substrate when a substrate is separated from a stage. An apparatus(10) for bonding a substrate includes a vacuum chamber(11) and a carrying-in/carrying-out globe, and bonds a top substrate supported in a top stage and a bottom substrate supported in a bottom stage under a decompression atmosphere. The vacuum chamber includes a top chamber(11A) and a bottom chamber(11B). The top stage(21) and the bottom stage(22) are installed inside the vacuum chamber. The carrying-in/carrying-out globe carries in/out the top substrate(1) and the bottom substrate(2). The substrate is absorbed in a robot hand.
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