| 摘要 |
PROBLEM TO BE SOLVED: To perform an abnormality determination of resin sealing automatically and exactly. SOLUTION: A resin sealing device 22 for resin sealing a substrate K (to be molded) arranged in a cavity 42 includes; a pressure sensor 70 to detect pressure of resin in the cavity 42, an operation unit 74 to calculate time rate of change of the detected pressure, a memory unit 72 to memorize a preset standard pressure, and a comparison/determination unit 78 to determine abnormalities of the resin sealing according to degree of disjunction between standard and real pressures; and revises a determination mode for abnormality of the resin sealing in response to the time rate of change in pressure. COPYRIGHT: (C)2009,JPO&INPIT |
