Various probe substrates for probing a semiconductor die and methods of use thereof are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first matrix array of conductor pins and a second matrix array of conductor pins on a probe substrate. The second matrix array of conductor pins is separated from the first matrix array of conductor pins by a first pitch along a first axis selected to substantially match a second pitch between a first semiconductor die and a second semiconductor die of a semiconductor workpiece.
申请公布号
WO2009024851(A3)
申请公布日期
2009.04.30
申请号
WO2008IB02158
申请日期
2008.08.15
申请人
ADVANCED MICRO DEVICES, INC.;ATI INTERNATIONAL SRL;GANGOSO, ANDREW;MARTINEZ, LIANE