| 摘要 |
PROBLEM TO BE SOLVED: To determine whether peeling occurs to an interface between a sealing resin and a circuit board of a resin-sealed type semiconductor device even if the peeling is not large enough to break a signal terminal of a semiconductor chip. SOLUTION: The semiconductor device 1 includes the semiconductor chip 2, the circuit board 3, a bonding wire 5, the sealing resin 6, an external electrode terminal 7, a test wiring line 8, and external electrode terminals 9a and 9b for test. The test wiring line 8 is installed in the sealing resin 6 and nearer an outer edge of the sealing resin 5 than the semiconductor chip 2 and bonding wire 5. Even if peeling which is not serious enough to break the signal terminal of the semiconductor chip 2 occurs to the interface between the sealing resin 6 and circuit board 3, the test wiring line 8 disposed at an outer edge of the interface is broken. Therefore, an electricity test of a state of conduction between the external electrode terminals 9a and 9b for test is conducted to determine whether the peeling is occurring. COPYRIGHT: (C)2009,JPO&INPIT |
