| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-chip module which can be made compact and improved in shielding property. SOLUTION: The multi-chip module includes a module substrate 2 on which an electronic component 3 is mounted, a conductor 8 electrically connected to a land 12 provided on the module substrate 2, a mold resin 6 covering the electronic component 3 and conductor 8, and a conductive film 7 formed continuously on the mold resin 6 and the conductor 8 exposed in the mold resin 6. COPYRIGHT: (C)2009,JPO&INPIT
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