| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To relieve internal stress when a printed circuit board for a semiconductor or the semiconductor device is manufactured, to reduce curvature variation of an interposer caused before or after a reflow stage, to stably manufacture the semiconductor device, and to improve the yield in a secondary mounting stage. <P>SOLUTION: The semiconductor device manufactured using the printed circuit board for the semiconductor device having a plurality of layers of conductor circuits is characterized in that a size variation amount after the reflow stage of the printed circuit board for the semiconductor device is≤0.04%. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
