| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To planarize surfaces of fine bumps formed on a substrate inexpensively and at high speed, and to easily and reliably connect bumps with each other without causing inconvenience such as dishing. <P>SOLUTION: A plurality of first bumps are formed on the surface of a first substrate, and a first insulating film is formed between the plurality of the first bumps. Planarization is performed by cutting using a byte so that the surfaces of the plurality of first bumps and the surface of the first insulating film become continuously planarized. A plurality of second bumps are formed on the surface of a second substrate, and a second insulating film is formed between the plurality of second bumps. The planarization is performed by cutting using the byte so that the surfaces of the plurality of second bumps and the surface of the second insulating film become continuously planarized. Then, the plurality of first bumps and the plurality of second bumps, and the first insulating film and the second insulating film are opposed to each other and connected with each other. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
