| 摘要 |
PROBLEM TO BE SOLVED: To provide a print mask which is not affected by the height of a solder precoat portion, exerts no influence on an arrangement interval between a micro electronic component and a large-sized electronic component, and eliminates a leakage of solder paste when the solder paste is supplied to another land of a printed circuit board where the solder precoat portion is formed, and to provide a method for mounting the printed circuit board which is shortened in process by performing printing of the large-sized electronic component on a land and flux application onto the solder precoat simultaneously. SOLUTION: Disclosed is the print mask 1 for printing the solder paste 15 on an other land 12b of the printed circuit board 11 having solidified solder 13 at a partial land 12a. The print mask 1 is formed by stacking an outside mask 3 made of a metal material and a mask 5 on a printed circuit board side which is made of a buffer material, which in tern is fixed and formed to be present corresponding to a periphery of an opening portion 2 of the mask 5 for printing at least the paste 1 and the solidified solder 13 of the printed circuit board 11 and its periphery. COPYRIGHT: (C)2009,JPO&INPIT |
