MANUFACTURING METHOD FOR WIRING BOARD, DISPLAY DEVICE AND THIN-FILM ACTIVE-ELEMENT SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board and a manufacturing method for the wiring board improving the productivity and fine workability of a wiring formation and enhancing the reliability of a device by lowering the possibility of the disconnection of the device formed to the upper layer of the wiring and the wiring when forming the wiring by conductive ink. SOLUTION: The manufacturing method for the wiring board has a stage coating the upper section of a substrate with a resin layer as an insulator after at least a curing and the stage forming trenches to the resin layer. The manufacturing method further has the stage selectively supplying the regions of the trenches with conductive ink as a conductivity after at least the curing. COPYRIGHT: (C)2009,JPO&INPIT