| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is reducible in thickness-directional dimension, and to provide a manufacturing method thereof. SOLUTION: The wiring board 10 has a solder resist layer 11 having a through portion 25, a pad 13 for external connection provided to the through portion 25, a wiring pattern 14 electrically connected to the pad 13 for external connection, and a diffusion preventive film 12 formed at least on a connection surface 13A of the pad 13 for external connection, the solder resist layer 11 being provided with the wiring pattern 13. COPYRIGHT: (C)2009,JPO&INPIT
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