发明名称 REVERSE PUNCHING APPARATUS FOR PROCESSING OF THE LEAD FRAME
摘要 A reverse punching process apparatus of a lead frame is provided to prevent damage of a pad part or a lead due to deformation or powder generated in punching an inside lead of a lead frame. A reverse punching process apparatus of a lead frame includes a punch(130), a mold(150), and a stripper(170). The punch is positioned on a bottom side of an inside lead, and reversely punches the inside lead from a bottom side to a top side. The stripper is contacted in one surface of a base material of the lead frame, and supports the base material of the lead frame. The mold is contacted in the other surface of the base material of the lead frame, and supports the base material of the lead frame. The mold has a scrap hole into a direction faced with the punch. The scrap is loaded in a hole of the mold.
申请公布号 KR20090042049(A) 申请公布日期 2009.04.29
申请号 KR20070107926 申请日期 2007.10.25
申请人 SHINWONTECH CO., LTD. 发明人 KIM, TAE KYUN;KIM, MYOUNG JOON;JANG, WOO HWAN;SHIN, YONG AN;HUH, KUN MOO;SONG, TAE HWAN
分类号 H01L23/50 主分类号 H01L23/50
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