METHOD FOR MANUFACTURING A CHIP ON CHIP SEMICONDUCTOR DEVICE

摘要

A manufacturing method of a chip-on-chip semiconductor device is provided to rapidly perform a signal transmission between semiconductor chips by directly connecting a metal wiring of a first wafer to a bump of a second wafer. A first wafer(101) having a metal wiring is prepared. A plurality of discontinuous points(172) is formed on the metal wiring. A second wafer(201) is prepared. A plurality of bumps(140A) corresponding to the discontinuous points is formed on a surface of the first wafer. The first wafer is arranged on the second wafer. The bumps of the second wafer are connected to the discontinuous points of the first wafer. The discontinuous points of the first wafer are formed on a bump pad.