| 摘要 |
A method of bonding and a bonding apparatus for a semiconductor chip that apply ultrasonic vibration to the semiconductor chip to bond the semiconductor chip to a substrate carry out leveling effectively at low cost and in a short time and can improve the bonding between the semiconductor chip and the substrate. In a positioning step, bumps of the semiconductor chip and pads of the substrate are positioned and placed in contact. In a leveling step, ultrasonic vibration of a first predetermined frequency is applied to the semiconductor chip to make the bumps of the semiconductor chip and the pads of a substrate rub against each other to level the bumps. In a bonding step, ultrasonic vibration of a second predetermined frequency that differs to the first predetermined frequency is applied to the semiconductor chip to bond the bumps and pads of the semiconductor chip and the substrate.
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