发明名称 THERMAL CONDUCTIVE POLYMER COMPOSITE AND ARTICLE USING THE SAME
摘要 A thermal conductive polymer composite is provided to show excellent thermal conductance even with the small amount of metal filler and ensure mechanical strength due to low-melting point metals and mixed metal filler. A thermal conductive polymer composite comprises 30~85vol% of crystalline resin, 5~69vol% of mixed metal filler and 1~10vol% of low-melting point metal whose a solidus temperature is lower than a melting point of crystalline polymer. The crystalline polymer is one or more polymers selected from the group consisting of polyphenylene sulfide, liquid crystal polymer, polyamide, syndiotactic polystyrene, polyetheretherketones, polypropylene and polyethylene.
申请公布号 KR20090041081(A) 申请公布日期 2009.04.28
申请号 KR20070106602 申请日期 2007.10.23
申请人 CHEIL INDUSTRIES INC. 发明人 KIM, SUNG JUN;HONG, CHANG MIN
分类号 C08L101/00;C08K3/08;C08K7/02 主分类号 C08L101/00
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