PHOSPHOR FILTER, METHOD OF MANUFACTURING PHOSPHOR FILTER, SEMICONDUCTOR PACKAGE USING PHOSPHOR FILTER, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING PHOSPHOR FILTER

摘要

A phosphor filter, a method for manufacturing the same, a semiconductor package using the same, and a method for manufacturing the semiconductor package are provided to remove a yellow band by installing the phosphor filter to reduce an area of a phosphor layer in a cavity. An LED package includes a substrate(40) with a cavity(46), an LED chip(42) mounted in a light emitting element mounting region inside the cavity, a wire(44) electrically connecting the LED chip to a pattern electrode, and a phosphor filter(110) horizontally installed in the upper part of the LED chip. The cavity of the substrate is divided to an upper cavity(46a) and a lower cavity(46b). The phosphor filter covers the opening of the lower cavity. A medium(48) is located in the space between the phosphor filter and the LED chip. A diffusion layer(56) is formed in the upper side of the phosphor filter.