发明名称 |
Methods of releasing photoresist film from substrate and bonding photoresist film with second substrate |
摘要 |
Provided is a method of releasing a photoresist film from a substrate, including: forming a self-assembled monolayer (SAM) on a substrate; coating the SAM with a photoresist film; and rinsing the substrate with an alcoholic group compound or an acid. A method of bonding a released photoresist film with a substrate includes arraying a second substrate and the photoresist film released from a first substrate using the above-described method, and baking the second substrate. According to the photoresist film releasing method, a photoresist film can be easily released from a substrate without damage after patterning. According to the bonding method, the photoresist film can be perfectly bonded with a second substrate without generating a crevice even though an additional adhesive is not used. When using the released photoresist film as an upper substrate of a microfluidic device, the manufacturing cost of the microfluidic device can be remarkably reduced compared to the manufacturing cost of existing microfluidic devices using a cover glass. |
申请公布号 |
EP1801652(A3) |
申请公布日期 |
2009.04.22 |
申请号 |
EP20060125111 |
申请日期 |
2006.11.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, CHIN-SUNG;HWANG, KYU-YOUN;KIM, JIN-TAE;LEE, YOUNG-SUN |
分类号 |
G03F7/16;G03F7/11;G03F7/40 |
主分类号 |
G03F7/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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