| 摘要 |
Disclosed is a semiconductor device, including an organic material-based substrate; a semiconductor chip, flip-chip connected to substantially a center of one surface side of the organic material-based substrate; a resin disposed to fill a space between the semiconductor chip and the organic material-based substrate; a lid member fixed to an outer peripheral region of a region the semiconductor chip is positioned at, on the one surface side of the organic material-based substrate to which the semiconductor chip is flip-chip connected and also fixed to the semiconductor chip in a side opposite to a flip-chip connected side of the flip-chip connected semiconductor chip; and a substrate support member disposed to extend from a vicinity of a portion of the lid member, the portion being fixed to the organic material-based substrate, and to protrude beyond a thickness of the organic material-based substrate in a thickness direction of the organic material-based substrate.
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