METHOD FOR MANUFACTURING WIRING BOARD

摘要

A method for manufacturing a wiring board is provided to reduce a diameter of an opening by forming the opening in an insulating layer by the laser. An insulating layer producing member is prepared. The insulating layer producing member has a support film and a semi-cured insulating layer. The semi-cured insulating layer is formed in the surface of the support film. The semi-cured insulating layer includes silica particles. The insulating layer producing member is adhered to a pad(37). The pad contacts the semi-cured insulating layer. The semi-cured insulating layer is cured. A cured insulating layer(24) is exposed to the laser. Openings(51,61) are formed in the cured insulating layer. The support film is removed from the cured insulating layer. Vias(26,39) are generated in the opening. The support film is removed before the via generating process.