发明名称 |
METHOD OF TREATING SUBSTRATE, PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE TREATING APARATUS AND RECORDING MEDIUM |
摘要 |
A method of treating a substrate, comprising the first step of setting a substrate with metal layer to be treated to a first temperature so that a treating gas containing an organic compound is adsorbed on the metal layer to thereby form a metal complex, and the second step of heating the substrate at a second temperature higher than the first temperature to thereby sublime the metal complex. |
申请公布号 |
KR20090035007(A) |
申请公布日期 |
2009.04.08 |
申请号 |
KR20097003835 |
申请日期 |
2007.08.10 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
MIYOSHI HIDENORI;ISHIKAWA KENJI;TATEISHI HIDEKI;HAYASHI MASAKAZU;NISHIKAWA NOBUYUKI |
分类号 |
H01L51/00;H01L21/3205;H01L21/324 |
主分类号 |
H01L51/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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