发明名称 METHOD OF TREATING SUBSTRATE, PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE TREATING APARATUS AND RECORDING MEDIUM
摘要 A method of treating a substrate, comprising the first step of setting a substrate with metal layer to be treated to a first temperature so that a treating gas containing an organic compound is adsorbed on the metal layer to thereby form a metal complex, and the second step of heating the substrate at a second temperature higher than the first temperature to thereby sublime the metal complex.
申请公布号 KR20090035007(A) 申请公布日期 2009.04.08
申请号 KR20097003835 申请日期 2007.08.10
申请人 TOKYO ELECTRON LIMITED 发明人 MIYOSHI HIDENORI;ISHIKAWA KENJI;TATEISHI HIDEKI;HAYASHI MASAKAZU;NISHIKAWA NOBUYUKI
分类号 H01L51/00;H01L21/3205;H01L21/324 主分类号 H01L51/00
代理机构 代理人
主权项
地址