发明名称 |
Semiconductor substrate surface protection method |
摘要 |
A semiconductor substrate surface protection method for maintaining surfaces thereof clean includes providing a tank containing pure water and a chemical protection material which is a high molecular straight-chain organic compound; and immersing the semiconductor substrate in the tank to deposit the high molecular straight-chain organic compound on the semiconductor substrate for maintaining the surfaces thereof clean. This convenient method prevents deposition of contaminating substances directly onto the semiconductor substrate and enables maintaining of this contaminant-free surface at a low cost.
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申请公布号 |
US7514371(B2) |
申请公布日期 |
2009.04.07 |
申请号 |
US20070700889 |
申请日期 |
2007.02.01 |
申请人 |
OKI SEMICONDUCTOR CO., LTD. |
发明人 |
TOMITA NORIKO;OHSAKO TAKASHI |
分类号 |
H01L21/027;H01L21/31;C11D11/00;H01L21/304;H01L21/306;H01L21/312;H01L21/469;H01L21/4763 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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