发明名称 LOW TEMPERATURE CO-FIRED CERAMICS AND METHOD OF MANUFACTURING THE SAME
摘要 A low temperature co-fired ceramic substrate and a manufacturing method thereof are provided to prevent a crack generation in a hetero-junction between ceramic layers having different coefficient of thermal expansion by including a buffer layer. A low temperature co-fired ceramic substrate(100) comprises a firs ceramic layer(111), a second ceramic layer(112), and a buffer layer(110). The first ceramic layer is made of material having a first coefficient of thermal expansion. The second ceramic layer is made of material having a second coefficient of thermal expansion higher than the first coefficient of thermal expansion. The buffer layer is positioned between the first ceramic layer and the second ceramic layer, and includes a first region(111') and a second region(112'). The first region is made of material such as the first ceramic layer. The second region is made of material such as the second ceramic layer, and has a plurality of through hole filling regions. The buffer layer prevents a defect due to the coefficient of thermal expansion between the first ceramic layer and the second ceramic layer.
申请公布号 KR100891814(B1) 申请公布日期 2009.04.07
申请号 KR20070109037 申请日期 2007.10.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHANG, MYUNG WHUN;LEE, JONG MYEON
分类号 H05K3/46 主分类号 H05K3/46
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