| 摘要 |
A interface board is provided with a first and second contact instruments each comprising a first and second contact terminal groups to which a first to third type semiconductor devices having different numbers of external terminals used can be connected. The first contact terminal group of the first contact instrument is connected to the corresponding terminals of the second contact terminal group of the second contact instrument using bridging lines. One end of each bridging wire is connected to a driver output pin of an channel provided in pin electronics. The other end of the bridging wire is connected to a comparator input pin of the IO channel provided in the pin electronics. The first contact terminal group of the second contact instrument is connected, using different connection lines, to a driver output pin and a comparator input pin of an IO channel provided in the pin electronics.
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