发明名称 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
摘要 |
To prevent short-circuit due to contact of bonding wires each other and to make a semiconductor device compact. A semiconductor chip with a rectangular main surface may comprise: a first side composing the main surface; a second side opposed to the first side; a main electrode pad group composed of a plurality of main electrode pads, which plurality of main electrode pads is arranged on the main surface along the first side; a first electrode pad group composed of a plurality of first electrode pads, which plurality of first electrode pads is arranged between the first side and the main electrode pad group; a second electrode pad group composed of a plurality of second electrode pads, which plurality of second electrode pads is arranged on the main surface along the second side; a first interconnection connecting the main electrode pad with the first electrode pad; and a second interconnection connecting the main electrode pad with the second electrode pad.
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申请公布号 |
US7514796(B2) |
申请公布日期 |
2009.04.07 |
申请号 |
US20060592161 |
申请日期 |
2006.11.03 |
申请人 |
OKI SEMICONDUCTOR CO., LTD. |
发明人 |
SAEKI YOSHIHIRO |
分类号 |
H01L23/48;H01L25/18;H01L21/60;H01L23/28;H01L23/31;H01L23/485;H01L23/495;H01L23/498;H01L23/52;H01L23/538;H01L25/065;H01L25/07 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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