发明名称 |
Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si Interposer |
摘要 |
Methods of assembling an integrated circuit are provided. An interposer supported by an integrated handler is solder bumped onto one or more bond pads on a substrate. The integrated handler is removed from the interposer. A side of the interposer opposite that of the substrate is solder bumped to one or more bond pads on a chip.
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申请公布号 |
US2009085202(A1) |
申请公布日期 |
2009.04.02 |
申请号 |
US20070862609 |
申请日期 |
2007.09.27 |
申请人 |
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发明人 |
DANG BING;INTERRANTE MARIO J.;KNICKERBOCKER JOHN ULRICH;SPROGIS EDMUND JURIS;TRAN SON K. |
分类号 |
H01L23/48;H01L21/44 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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