METHOD AND APPARATUS FOR ASSEMBLING SURFACE MOUNT DEVICES

摘要

Surface mount devices (SMDs) are mounted on singulated flexible printed circuit boards (FPCs) and/or singulated thin rigid printed circuit boards (Thin rigid PCBs) with great efficiency and high yield in an assembly process wherein a sheet of FPC or Thin rigid PCB that contents one or more pieces of circuit boards is separated into single non-interconnected pieces, a single piece or multiple pieces is/are precisely placed and arranged on a based plate hold by adhesive material and/or vacuum, and solder paste is dispensed or printed on the connecting pads of each circuit boards, and SMDs are mounted on the connecting pads, and the area that contents solder paste are selectively soldered using precise guided streams of spot hot air (or guided rays of UV lights or LASER beams).