| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component mounting device for mounting components at a high speed. <P>SOLUTION: The component mounting device includes: a mounting head 11 that can move to and fro, and up and down between a component supply position B and a substrate positioning part 14, and that can apply ultrasonic vibration to a held component 2; a recognition head 21 in which disposed in parallel are a component recognition means 24 for recognizing the component 2 held with the mounting head 11, and a substrate recognition means 25 for recognizing the position of a substrate 15, while the recognition head 21 is movable to and fro between an original position that is set between the component supply position B and a substrate position, and a substrate recognition position, where a component recognition position B or a component recognition moving region that is placed on a substrate 15 side from the original position, and the substrate recognition means 25 are arranged on the substrate 15; and a substrate positioning member 14 for positioning the substrate 15. <P>COPYRIGHT: (C)2009,JPO&INPIT |
