发明名称 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a formation method for patterning a positive photosensitive resin film so that the positive photosensitive resin film does not remain in openings. <P>SOLUTION: A method for manufacturing electronic components includes: a coating step of coating a substrate with a positive photosensitive resin composition comprising an alkali-soluble resin (A) and a diazonaphthoquinone compound (B) to form a resin layer; an exposure step of irradiating the desired parts of the resin layer with active energy rays; a development step of bringing an alkali developer into contact with the resin layer after the irradiation with the active energy rays; and a rinse step of rinsing off the alkali developer with a rinse liquid after the development step, wherein the rinse step is carried out by rinsing off the developer with the rinse liquid immediately after keeping the developer in contact with the resin layer for a predetermined time. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009069229(A) 申请公布日期 2009.04.02
申请号 JP20070234835 申请日期 2007.09.11
申请人 SUMITOMO BAKELITE CO LTD 发明人 MIZUSHIMA AYAKO
分类号 G03F7/30;C08G69/42;G03F7/023;H01L21/027 主分类号 G03F7/30
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