| 摘要 |
A reduction press apparatus for preventing the manufacture fault of a bonded substrate is provided to reduce the manufacture fault of the bonded substrate by bonding a first substrate and a second substrate by entering the first substrate and the second substrate within a process room. A first retention element supports an upper supporting plate installed within the process chamber. A load cell measures the weight of the supporting plate and the first retention element. The load cell outputs the measured value. A measured value is applied in the load cell by relaxing reaction force when welding a first substrate and a second substrate. The control unit controls in order to add pressure to the first substrate and the second substrate based on the measured value. The pressurization unit adds pressure to the supporting plate. The pressure applied to the supporting plate is the pressure adding the pressure of the pressurization unit to the total pressure. |
