| 摘要 |
PROBLEM TO BE SOLVED: To deposit a magnetic film of high quality in the formation of a magnetic film. SOLUTION: Regarding the magnetron sputtering system, a substrate 8 is arranged at the inside of a sputter chamber 1, and a magnetic film is formed on a surface of the substrate 8 by magnetron sputtering, wherein cathodes 2, 2 for respectively holding targets 21, 21 made of a magnetic material and of a material different from the magnetic material are installed in such a manner that the central axes of the targets 21, 21 and the central axis of the substrate 8 are crossed at an angleθ, and the diameter d of the substrate 8 and the diameter D of the targets 21, 21 have the relation of d≥D. The system further comprises: a rotating mechanism for rotating the substrate 8; magnets 22, 22 located at the back of the cathodes 2, 2; a magnetic field generator 7 located at the outer circumferential region of the substrate 8; and a rotating driving means for rotating the magnetic field generator 7 around the substrate 8. COPYRIGHT: (C)2009,JPO&INPIT
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