| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat pipe panel which can mount thereon an radiation type electronic device having a high heat generation density while eliminating the need for enlarging a panel because of a small thermal resistance from the mounted device to a heat pipe. SOLUTION: A heat pipe 3 buried in a heat panel 1 is provided at its both ends or one end with a heat collecting plate 3a which collects heat emitted from an electronic device 5 mounted on one end of the panel 1 and transmits the collected heat to the heat pipe 3, and is also provided with a filter tube 3b which fills an operating fluid into the heat pipe 3 at a position other than the both ends of the heat pipe 3. COPYRIGHT: (C)2009,JPO&INPIT
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