| 摘要 |
PROBLEM TO BE SOLVED: To form an adhesive layer between a semiconductor element and a circuit board into a shape whose bottom is spread enough toward the circuit board, when the semiconductor element is mounted on the circuit board. SOLUTION: In a method for manufacturing a semiconductor device, a first adhesive layer 12 is beforehand formed at the periphery of a mounting position of the semiconductor element 13 on the circuit board 11 on which the semiconductor element is mounted. Further a second adhesive layer 15 is beforehand formed on the mounting surface of the semiconductor element. The semiconductor element is arranged on the circuit board, and the first adhesive layer and the second adhesive layer are melted and integrated to form a fillet 16. COPYRIGHT: (C)2009,JPO&INPIT
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