COMPOSITION OF SEMICONDUCTOR ATTACHING PASTE

摘要

An adhesive paste composition for a semiconductor device is provided to ensure properties of adhesive, for example, printing characteristic, die attachment and moisture-resistance, and to solve viscosity increase and heat/electric conductivity. An adhesive paste composition for a semiconductor device comprises base resin and additives. The additives comprise inorganic filler 0.1-5 parts by weight based on the whole composition 100.0 parts by weight. The inorganic filler comprises the first inorganic filler component having low specific gravity and molecular weight and the second filler component having low specific gravity and molecular weight. The second filler component is contained in the amount of 10-30 parts by weight based on the first inorganic filler.