Circuit device, circuit module, and outdoor unit

摘要

Provided is a circuit device (10) capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device (10), a first circuit board (18) and a second circuit board (20) are incorporated into a case member (12) being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element (22) is arranged on the upper face of the first circuit board and a second circuit element (24) is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (26) (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening (15A,15B), which is provided by partially opening the case member.