发明名称 LIGHT EMITTING DIODE PACKAGE HAVING ASYMMETRIC LENS
摘要 A light-emitting diode package having lens is provided to prevent the reduction of the luminous efficiency by forming the lens into the curved surface along the second direction. A light-emitting diode package comprises a package body(11), the first and second leads(13a,13b), a light emitting diode die, and a lens(33). The light-emitting diode package comprises a heat sink and a molding unit. The package body supports the first and second leads. The package body has the opening exposing the parts of leads. The leads expose the package body to the outside. The heat sink emits the heat generated from the light emitting diode die to the outside. The light emitting diode die is mounted to the package body. The light emitting diode die is electrically connected to the first and second leads. The lens covers the light emitting diode die and bonding wires.
申请公布号 KR20090032864(A) 申请公布日期 2009.04.01
申请号 KR20070098427 申请日期 2007.09.28
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 LEE, SANG CHUL;SEO, TAE WON;JUNG, CHAN SUNG
分类号 H01L33/58 主分类号 H01L33/58
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