发明名称 |
METHOD FOR ENCASING ELECTRONIC COMPONENTS AND INTEGRATED CIRCUITS |
摘要 |
The present invention relates to the field of electronic devices and their associated driver and/or controller integrated circuits and in particular to the mechanical packaging of electronic devices and to the packaging of electronic devices and their associated driver and/or controller integrated circuits. |
申请公布号 |
EP2041787(A1) |
申请公布日期 |
2009.04.01 |
申请号 |
EP20070725728 |
申请日期 |
2007.06.01 |
申请人 |
SCHOTT AG |
发明人 |
LEIB, JUERGEN;YAMAMOTO, HIDEFUMI |
分类号 |
H01L23/053 |
主分类号 |
H01L23/053 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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