| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of controlling adhesive power of a base film of an adhesive tape which can prevent an adhesive agent from transferring to a dicing frame in a dicing frame bonding portion and which has excellent separating property at an interface between an adhesive agent layer and the base film when a chip is separated in a wafer bonding portion. <P>SOLUTION: In the base film of the adhesive tape for dicing and die bonding of the semiconductor wafer, adhesive property is given to the adhesive agent layer by corona discharge and surface treatment of irradiation of energy rays such as a low-pressure mercury lamp, so that the adhesive agent layer and the base film are separable from each other at their interface in the wafer bonding portion, and that the adhesive agent layer and the dicing frame are separable from each other at their interface in the dicing frame bonding portion. A surface treatment portion 2 and a non-treatment portion 3 are provided in the base film 1, and the dicing frame is bonded to the dicing frame bonding portion 4. <P>COPYRIGHT: (C)2009,JPO&INPIT |
