| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer such that an identification code does not disappear in spite of grinding, a device region is not limited, and the printed identification code can be read without misrecognition. <P>SOLUTION: The wafer has a device region where a plurality of devices are formed, and an outer peripheral surplus region which surrounds the device region, on the face of a circular wafer substrate. A chamfered portion whose cross-sectional shape has an arc-shaped surface in a range from the face to the back of the wafer substrate is formed in an outer peripheral end portion of the outer peripheral surplus region of the wafer substrate. A flat surface orthogonal to the face and the back is formed in the chamfered portion as a mark showing the crystal orientation of the wafer substrate. An identification code for specifying the wafer substrate is printed on the flat surface. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
