CURABLE RESIN COMPOSITION AND CURED PRODUCT

摘要

Disclosed is a curable resin composition characterized by containing a polymer A which contains at least an epoxy group-containing vinyl monomer a1 as a monomer component, and a polymer B which contains at least an alkoxysilyl group-containing vinyl monomer represented by the formula (I) below as a monomer component. This curable resin composition enables to form a cured product which is excellent in hardness, solvent resistance, heat resistance and adhesion to a base. (I) (In the formula (I), R1 represents a hydrogen atom of an alkyl group having 1-7 carbon atoms; E represents a single bond or a divalent hydrocarbon group; R2 and R3 may be the same or different and each represents an alkyl group having 1-6 carbon atoms or an alkoxyl group having 1-6 carbon atoms; R4 represents an alkyl group having 1-6 carbon atoms; x represents 0 or 1; and y represents an integer of 1-10.)