| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a means for stabilizing the joint position of a cap joined to the mounting substrate of a semiconductor device. <P>SOLUTION: This method for manufacturing a semiconductor device equipped with a mounting board, a semiconductor chip mounted on the front face of the mounting board; and a gap with a recess in which the semiconductor chip is stored whose open end is jointed to the front face of the mounting substrate by a joint member includes a process for placing the upper face of the cap whose open end is provided with the joint member on the repair tool bottom face of a cap mounting repair tool having a repair tool bottom face whose shape is the same as that of the upper face at the opposite side of the open end of the cap, an opening lager than the outer shape of the mounting substrate and a slope enlarged from the repair tool bottom face to the opening; and a process for making the end section of the mounting substrate on which the semiconductor chip is mounted follow the slope of the cap mounting repair tool, and for placing the front face of the mounting substrate on the joint member of the open end of the cap. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
