发明名称 Semiconductor device having multiple substrates
摘要 A semiconductor device includes a first substrate including first, second and third layers; and a second substrate including fourth, fifth and sixth layers. The first substrate provides an electric device. The second substrate provides a physical quantity sensor. The first layer of the first substrate and the fourth layer of the second substrate are shields for protecting the electric device and the physical quantity sensor. The device is protected from outside disturbance without adding an additional shield.
申请公布号 US2009079017(A1) 申请公布日期 2009.03.26
申请号 US20080292068 申请日期 2008.11.12
申请人 DENSO CORPORATION 发明人 FUJII TETSUO
分类号 G01P15/125;H01L29/92;B81B3/00;B81B7/00;G01P1/02;G01P15/08;H01L23/00;H01L23/12;H01L23/50;H01L23/552;H01L25/065;H01L29/76;H01L29/84;H01L31/062 主分类号 G01P15/125
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