| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting module enhancing the degree of thermal coupling between light-emitting diode chips and a cooling fluid. <P>SOLUTION: A cooling chamber 9 to which a cooling fluid 13 for cooling a plurality of light-emitting diodes 3 is injected is formed on a package 2 storing the light-emitting diode chips 3. The package 2 has a flow-in port 14 for flowing the cooling fluid 13 into the cooling chamber 9 from the outside, and a flow-out port 15 for flowing the cooling fluid 13 from the cooling chamber 9 to the outside. In the cooling chamber 9, the light-emitting diode chips 3 are immersed in the cooling fluid 13. <P>COPYRIGHT: (C)2009,JPO&INPIT |
