| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for stereolithographic use, which absorbes little moisture even when it is stored under a high humidity condition for a long time, prevents excessive lowering of moisture content in the case of storing under a low-humidity condition for a long time to keep the moisture necessary for photosetting, maintains high curing sensitivity independently of the humidity in a storing environment and can be suitably used for forming a model having high form accuracy, dimensional accuracy, water resistance, moisture resistance and mechanical properties within a short forming time. SOLUTION: The resin composition for stereolithographic use contains (A) a cationic polymerizable organic compound, (B) a radically polymerizable organic compound, (C) a cationic polymerization initiator, (D) a radical polymerization initiator, and a diol expressed by general formula HO-R<SP>2</SP>-OH (wherein R<SP>2</SP>is a 5-8C straight or branched-chain alkylene group) at prescribed ratios, wherein the cationic polymerizable organic compound (A) contains a prescribed amount of a diglycidyl ether (I) of formula (I) (in the formula, R<SP>1</SP>is a hydrogen atom or a methyl group). COPYRIGHT: (C)2009,JPO&INPIT |
