发明名称 MOLD TEMPERATURE ADJUSTMENT APPARATUS AND COOLING UNIT FOR MOLD TEMPERATURE ADJUSTMENT APPARATUSES
摘要 PROBLEM TO BE SOLVED: To provide a mold temperature adjustment apparatus and a cooling unit for the mold temperature adjustment apparatuses in which the state of the adhesion of a scale such as silica and magnesium is easy to be grasped, and cleaning maintenance is easy. SOLUTION: In the mold temperature adjustment apparatus A which provides a heater 10 and a cooler 6, and adjusts and controls a temperature of a molding mold by being connected and added to a thermoregulating medium circulation way that the thermoregulating medium which is thermoregulated by the heater and the cooler circulates and flows, the heater is provided in the mold temperature adjustment apparatus body, the cooler is provided outside the mold temperature adjustment apparatus body. The cooler is provided with a body unit 61 having a cooling pipe 61a through which the thermoregulating medium circulates and which is connected to contact with the mold temperature adjustment apparatus body, and a cooling water tank 62 for cooling the cooling pipe by submerging the cooling pipe in cooling water. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009061715(A) 申请公布日期 2009.03.26
申请号 JP20070232693 申请日期 2007.09.07
申请人 MATSUI MFG CO;MATSUI SDI:KK 发明人 MATSUMOTO AKIHIKO
分类号 B29C33/04 主分类号 B29C33/04
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