发明名称 |
FILTERED FEEDTHROUGH ASSEMBLIES FOR IMPLANTABLE DEVICES AND METHODS OF MANUFACTURE |
摘要 |
<p>A solder joint between a capacitive element and a ferrule of a filtered feedthrough assembly for an implantable medical device is formed from a solder pre-form mounted on a portion of an external surface of the capacitive element, which portion of the external surface may be overlaid with a layer including a noble metal. Another solder joint may be formed between the capacitive member and each feedthrough pin; and, for an assembly including a plurality of feedthrough pins, each of the other solder joints may be formed from a solder pre-form mounted onto the external surface of the capacitive element by inserting each pin through a corresponding ring of a plurality of rings connected together to form the solder pre-form.</p> |
申请公布号 |
WO2009039006(A1) |
申请公布日期 |
2009.03.26 |
申请号 |
WO2008US75769 |
申请日期 |
2008.09.10 |
申请人 |
MEDTRONIC, INC.;IYER, RAJESH V.;MILTICH, THOMAS P. |
发明人 |
IYER, RAJESH V.;MILTICH, THOMAS P. |
分类号 |
A61N1/375;B23K1/00;B23K35/02;H01G2/10;H01G4/224;H01G4/236;H01G4/35;H01L21/48;H05K3/34 |
主分类号 |
A61N1/375 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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